2026 2nd International Conference on Intelligent Manufacturing and Mechatronics (ICIMM 2026) will be held from October 23 to 25, 2026, in Nanchang, Jiangxi, China.

𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://ais.cn/u/mEB7ju

---𝗖𝗮𝗹𝗹 𝗙𝗼𝗿 𝗣𝗮𝗽𝗲𝗿𝘀---
The topics of interest for submission include, but are not limited to:
◕Track1: Intelligent manufacturing system and high performance manufacturing technology Intelligent Manufacturing System
Digital production process
Additive manufacturing process
Design of flexible manufacturing unit
Precision and ultra-precision machining
Manufacturing technology of complex structural parts
Manufacturing process perception and monitoring technology
Reconfigurable manufacturing platform
Automotive Manufacturing and Testing Technology
Detection and analysis of engineering materials
Aircraft digital manufacturing
Intelligent composite material manufacturing
Digital twin

◕Track2: Mechatronics system integration and embedded control technology
Modeling and analysis of electromechanical system
Embedded Controller Design
Motion control of industrial robot
Vehicle embedded control system
Electromechanical technology of urban rail transit
Automotive Service Engineering
Industrial Internet of Things
Analog circuits and digital circuits
Motor drive and control
Aerospace flight control system
UAV automation technology
Precision mechanical structure and design optimization
Intelligent Chassis and Suspension System

---𝗞𝗲𝘆𝗻𝗼𝘁𝗲 𝗦𝗽𝗲𝗮𝗸𝗲𝗿𝘀---
Prof. Wei Xu,Institute of Electrical Engineering, Chinese Academy of Sciences,IEEE Fellow, IET Fellow

---𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻---
All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published SAE Technical Papers (ISSN: 0148-7191) in conference proceedings and submit to EI Compendex and Scopus for indexing.

---𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀---
Registration Deadline: October 9, 2026
Final Paper Submission Date: October 9, 2026
Conference Dates: October 23-25, 2026

--- 𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻---
Please send the abstract or full paper(word+pdf) to Submission System:
https://ais.cn/u/mEB7ju