*** DTTIS 2023 - Call For Contributions ***

--- DTTIS conference (International Conference on Design, Test and Technology of Integrated Systems) ---

Venue: Gammarth, Tunisia
Dates: November 1-4, 2023
Website: https://www.dttis.org/

Aim of the Conference: DTTIS conference (International Conference on Design, Test and Technology of Integrated Systems) is the result of merging two established IEEE conferences: DTIS (International Conference on Design and Technology of Integrated Systems in nanoscale era), and DTS (International Conference on Design and Test of Integrated Systems).
The aim of the conference is to cope with the rapidly progressing technology which, today, reaches the nanometer scale. The areas of interest include design, test and technology of electronic products, ranging from integrated circuit modules, chiplets and printed circuit boards to full systems and microsystems, as well as the methodologies and tools used in the design, verification and validation of such products. DTTIS will show innovations in system and platform design, which extend beyond a single integrated circuit.
These platforms may include 2.5D/3D chiplet based system-in-package, system-on-interposer, and multi-die integrations. It will be an opportunity for researchers to present and discuss their latest work. DTTIS is, by design, a forum for engineers, researchers, graduate students and professors, to cross the design-technology boundary by bringing design, test, technology, and process experts together.
DTTIS will be organized annually in a Mediterranean country. The first edition is scheduled to be held in Tunis, Tunisia in the region of Gammarth. All accepted and presented papers will be published on the DTTIS Conference Proceedings and submitted for publication in IEEE Xplore. Best papers will be submitted for possible publication in a special issue of well-known journal.
Papers are solicited in, but not limited to, the following topics:

Integrated Systems Design

Analog, digital, mixed, and RF circuits design
System-on-a-chip (SoC) & System of Chips (SoC), MPSoC, NoC, SIP, and NIP design
Embedded/ multiprocessor systems
Hardware design for AI
AI accelerators
MEMS, NEMS and MOEMS systems design
Synthesis (physical, logic,...)
Simulation, Validation & Verification
Bio-engineering & Bio-chip design
Electronics for energy harvesting
Wireless communication systems design
Opto-electronic System Design
Biomedical Circuit & Systems
Power electronics and systems design
Sensory Systems Design
Chiplet and disaggregation
Integrated Systems Testing

Defect and Fault Modeling
Analog, digital circuit test
Mixed, and RF circuit testing
MEMS/NEMS/MOEMS Testing
3D/2.5D Test
Memory test
Repair and diagnosis
Reliability
DFT, BIST and BISR
Alternatives test strategies
Fault Simulation, ATPG
Yield Optimization
Automotive reliability and test
Reliability failures and modeling
Electronic System Reliability
Test and Security Issues
ATE issues
On-line Testing and fault Tolerance
Delay testing
Integrated Systems Technology

Process technologies
Device modeling
Material characterization
Failure analysis
Emerging technologies
ICs Packaging
Process technology
Reliability issues
2.5 & 3D integration
Circuit integrity
Key Dates for Scientific Papers:

Paper pdf Submission Deadline: July, 4th 2023
Notification of acceptance: August, 8th 2023
Final version due date: August, 23th 2023
Online submission: https://easychair.org/