| |||||||||
COINS 2025 : IEEE International Conference on Omni-layer Intelligent Systems | |||||||||
| |||||||||
Call For Papers | |||||||||
CALL FOR PAPERS
IEEE International Conference on Omni-layer Intelligent Systems University of Wisconsin–Madison, USA | August 4-6, 2025 https://coinsconf.com Important Dates: Abstract submission: 1 April 2025 Full paper submission: 8 April 2025 Special session, workshop, tutorial proposal submission: 8 April 2025 Acceptance notification: 31 May 2025 Camera-ready submission: 21 June 2025 Are you interested in taking part in shaping and adding new dimensions to the future IoT and AI ecosystem? Do you want to stay ahead and learn about the most prominent digital technologies that are radically shifting the paradigm? Or are you just curious about what IoT, AI, and Big Data are all about and how they impact every aspect of our lives, society, and business? IEEE COINS (https://coinsconf.com) is the right place to be. IEEE COINS brings together experts in Digital Transformation (from AI and IoT to Cloud, low power design, security, privacy, and robotics) from around the globe. IEEE COINS includes a multi-disciplinary program, from technical research papers to panels, workshops, and tutorials on the latest technology developments and innovations. IEEE COINS will address all important aspects of the of the IoT/AI ecosystem. IEEE COINS solicits papers and proposals accompanying submissions for presentations in the following topical and vertical tracks: Topical Area Tracks 1. Internet of Things: From Edge to Cloud 2. Sensing Devices and Systems for AIoT 3. Circuits and Systems (CAS) Designs AIoT 4. Communications and Networking for AIoT 5. Artificial Intelligence, Machine Learning, and Cognitive Computing 6. Distributed Ledger Technologies and Blockchain 7. Low Power Design and Automation 8. Security and Privacy 9. Intelligent Robots and Systems 10. Embedded AI Vertical Tracks 1. Smart Infrastructure - Smart City - Energy and Smart Grids - Smart Agriculture - Smart Mobility, Transportation, and Logistics 2. Industry 4.0 and Smart Manufacturing 3. Digital Healthcare and Well-being Special Tracks 1. Emerging Technologies on Intelligent Systems 2. Generative AI: Systems, Architectures, and Applications Panels 1. Diversity, Equity, and Inclusion 2. Industrial Talks 3. Workshops/Tutorials Organizing Committee General Co-Chairs Umit Yusuf Ogras, University of Wisconsin-Madison Amit Singh, University of Essex Technical Program Co-Chairs Fatemeh Afghah, Clemson University Priya Panda, Yale University Publicity Chair Co-Chair Aly Sabri Abdalla, Mississippi State University Nicola Dall' Ora, University of Verona, Italy Jaeha Kung, Korea University Sumit K Mandal, IISC Bangalore Oktay Cetinkaya, Univ. of New Castle |
|