|
|
|
| |||||||||||||
ICMPC 2026 : 2026 3rd International Conference on Materials Physics and Composites | |||||||||||||
| Link: https://ais.cn/u/FjMfQj | |||||||||||||
| |||||||||||||
Call For Papers | |||||||||||||
|
2026 3rd International Conference on Materials Physics and Composites (ICMPC 2026) will be held on July 10-12 in Kunming, China.
饾棖饾椉饾椈饾棾饾棽饾椏饾棽饾椈饾棸饾棽 饾棯饾棽饾棷饾榾饾椂饾榿饾棽: https://ais.cn/u/FjMfQj ---饾棖饾棶饾椆饾椆 饾棾饾椉饾椏 饾椊饾棶饾椊饾棽饾椏饾榾--- The topics of interest for submission include, but are not limited to: Track 1: Macromolecular Materials and Polymer Physics 路 Macromolecular physics and structure 路 Polymer chain conformation and dynamics 路 Structure鈥損roperty relationships of macromolecules 路 Polymer crystallization and phase behavior 路 Thermodynamics of polymer systems 路 Physical chemistry of polymers 路 Molecular weight effects and polydispersity 路 Rheology and viscoelastic behavior of polymers 路 Polymer blends and miscibility 路 Self-assembly of macromolecules Track 2: Polymer Composites and Functional Macromolecules 路 Polymer matrix composites 路 Fiber-reinforced polymer composites 路 Nanocomposites and hybrid macromolecular systems 路 Interface and interphase in polymer composites 路 Functional macromolecules and smart polymers 路 Conductive and electroactive polymers 路 Polymer-based structural materials 路 Mechanical performance of polymer composites 路 Lightweight and high-performance composites 路 Multifunctional macromolecular materials Track 3: Materials Physics of Polymers and Soft Matter 路 Materials physics of polymers 路 Soft matter physics 路 Polymer solid-state physics 路 Glass transition and relaxation phenomena 路 Molecular mobility and diffusion in polymers 路 Physical aging and deformation mechanisms 路 Fracture and fatigue of polymer materials 路 Thermal transport in macromolecular materials 路 Mechanical and dynamic behavior of soft materials 路 Polymer physics under extreme conditions Track 4: Advanced Preparation and Processing of Macromolecular Materials 路 Polymer synthesis and modification 路 Advanced polymer processing technologies 路 Processing鈥搒tructure鈥損roperty relationships 路 Additive manufacturing of polymer materials 路 Solution processing and melt processing 路 Surface and interface engineering of polymers 路 Processing of polymer composites 路 Scale-up and manufacturability of macromolecular materials 路 Sustainable processing of polymer materials 路 Processing-induced microstructure evolution Track 5: Nanostructured and Molecular-Level Materials 路 Nanostructured macromolecular materials 路 Polymer nanomaterials and nanotechnology 路 Molecular-level design of materials 路 Hybrid organic-inorganic macromolecular systems 路 Nanofillers in polymer matrices 路 Self-assembled nanostructures 路 Molecular interactions and nanoscale effects 路 Characterization of nanostructured polymers 路 Nanomechanics of macromolecular materials Track 6: Emerging Topics in Materials Physics and Composites 路 Materials physics and structure 路 Solid-state physics of materials 路 Optoelectronic polymer materials 路 Microelectronic and electronic polymer materials 路 Semiconductor and polymer-based devices 路 Superconducting and functional materials 路 Energy-related polymer materials 路 Physics-guided materials design 路 Computational modeling of materials 路 Cross-disciplinary materials research ---饾棪饾椊饾棽饾棶饾椄饾棽饾椏饾榾--- Prof. Shichun Mu,Wuhan University of Technology, China Prof. Jiachang Zhao,Shanghai University of Engineering Science, China ---饾棧饾槀饾棷饾椆饾椂饾棸饾棶饾榿饾椂饾椉饾椈--- All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Journal of Physics: Conference Series (JPCS) (ISSN:1742-6596) in the format of Conference Proceedings and submitted to EI Compendex, Scopus for indexing. ---饾棞饾椇饾椊饾椉饾椏饾榿饾棶饾椈饾榿 饾棗饾棶饾榿饾棽饾榾--- Submission Deadline: June 1, 2026 Registration Deadline: June 16, 2026 Final Paper Submission Date: June 19, 2026 Conference Dates: July 10-12, 2026 ---饾棧饾棶饾椊饾棽饾椏 饾棪饾槀饾棷饾椇饾椂饾榾饾榾饾椂饾椉饾椈--- Please send the full paper(word+pdf) to Submission System: https://ais.cn/u/FjMfQj |
|
