2nd IEEE International Conference on
Design & Test of integrated micro & nano-Systems

June 7 - 10, 2020, Hammamet, Tunisia

http://www.dts-conf.org/index.php

Aim of the Conference:
The Second IEEE international conference on Design & Test of integrated micro & nano-Systems IEEE DTS 2020 represents a scientific and technological event dedicated to integrated electronic systems which reach the nanoscale era. The interests of the conference cover all the aspects from the design to the test of micro and nano systems. IEEE DTS 2020 is an important meeting where well known researchers from universities and companies will present the latest innovations in the field of micro and nano electronics. It will be also an opportunity for researchers to present and discuss their latest work.

All accepted and presented papers will be published on the DTS Conference Proceedings and submitted for possible publication on IEEE Xplore.

GENERAL SCOPE
Systems Design & Technology (SDT) :
• Analog, digital, mixed, and RF circuits design
• SoC, MPSoC, NoC, SIP, and NIP design
• Embedded electronics and System architecture
• MEMS, NEMS and MOEMS systems design
• Low-power electronics and systems design
• Sensory Systems Design
• Wireless communication systems design
• Opto-electronic System Design
• Biomedical Circuit & Systems
• Bio-engineering & Bio-chip design
• Linear & Non-Linear Circuits
• Power electronics and systems design
• Hardware co-design & FPGA design
• VLSI systems circuit and design
• DSPs and multiprocessor systems
• Embedded systems for Deep Learning
• Control Systems & Mechatronics
• Algorithms, methods and tools for modeling, simulation, synthesis and verification of ICs
• Algorithms, methods and tools for signal processing and image processing
• Algorithms, methods and tools for information security and cryptography
• Artificial Intelligence systems
• Electronic systems for energy harvesting applications
• GPS based engineering systems
• Process technologies, CMOS, BiCMOS, GaAs
• Microwave Systems & Integrated antenna
• 3D integration design and analysis
• ICs packaging
Systems Testing & Reliability (STR) :
• Analog, digital, mixed, and RF circuits testing
• SoC, MPSoC, NoC, SIP, and NIP test
• On-line Testing and fault Tolerance
• Defect and Fault Modeling
• MEMS, NEMS and MOEMS Testing
• 3D testing
• Delay testing
• DFT, BIST and BISR
• Fault Simulation, ATPG
• Yield Optimization
• Memory & FPGA Test and Repair
• Automotive reliability and test
• Reliability failures and modeling
• Electronic System Reliability
• Test and Security Issues
• ATE issues
• Alternatives test strategies
Nano Electronic Systems (NES) :
• Nanostructured / nanoporous Materials and devices
• Nano-circuits and Nano-architectures
• Nano-sensors and Actuators
• Nanorobotics and Nano-manipulation
• Modeling and Simulation at the Nanoscale
• Carbon Nanostructures and devices
• Microfluidics and Nanofluidics Systems
• 3D printing systems
• Polymer Nanotechnology
• Nanoscale Materials Characterization
• Sensors based on emerging devices
• Renewable Energy Technologies
• Smart Grid
• Measurement of health risk
• Aerospace and Vehicle Manufacturers
VLSI IoT Devices (IoT) :
• Ultra-low power VLSI design for IoT
• System on Chip for IoTs
• IoT Application oriented Technologies
• IoT communication systems
• Real-time IoT systems
• RFID systems
• IoT Services and Applications
• IoT nodes architectures
• Sensors and Actuators for IoT
• Power and Energy systems design for IoT nodes
• Connectivity for IoT
• Computing Platforms for IoT
• Data Acquisition, Storage and Management for IoT
• Security and Privacy Enhancing Technologies for IoT devices
• IoT System Interfaces
• Reliability of IoT VLSI
Paper Submission Deadline : February, 02nd 2020

Notification of acceptance : March, 15nd 2020

Final version due date : April, 6th 2020