CALL FOR PAPERS

About the EOS/ESD Symposium
The ESD Association, in cooperation with IEEE, is sponsoring the 33rd Annual Symposium on Electrical Overstress (EOS) and Electrostatic Discharge (ESD) effects. The Symposium will be dedicated to the understanding of issues related to electrical transients and electrical overstress, and the application of this knowledge to the solution of problems in consumer, industrial and military applications, including electronic components and manufacturing, as well as in systems, subsystems and equipment.

Technical Papers
The Technical Program Committee solicits paper contributions, including data and analysis that advance the state-of-the-art knowledge, enhance or review the general knowledge, or discuss new topics related to EOS/ESD. Paper Presentations at the Symposium will be in electronic Power Point® format.

Abstracts
Authors must submit a 50-word abstract and 4-page (maximum) summary of their work. The summary must clearly state the purpose, results (e.g., data, diagrams, photographs, etc.), and conclusions of the work. Summaries must also include references to prior publications and state how the work enhances existing knowledge. Authors must designate the appropriate technical area related to their work and submission. See reverse for suggested, but not restricted, topic listings. Authors are encouraged to use the abstract submission toolkit available on the ESD Association’s website www.esda.org.
Presentation of work at the International ESD Workshop (IEW) will not preclude an abstract submission, as long as the submission follows the EOS/ESD Symposium guidelines. If the IEW work is submitted to the EOS/ESD Symposium, it is required that the IEW work is expanded upon significantly (e.g. 50% increase of data graphs) in the abstract submission for the EOS/ESD Symposium in order to be considered for acceptance.
Electronic Submissions
Abstract submissions shall be made electronically via an emailed PDF file to info@esda.org. One file for each submission is required.

Paper Acceptance
The Technical Program Committee will accept unpublished papers for peer review with the understanding that the author will not publish elsewhere the work prior to presentation at the Symposium. Accepted papers published in any form prior to presentation at the Symposium may result in the paper being withdrawn from the Symposium Proceedings. Authors must obtain appropriate company and government clearances prior to submitting their abstracts.

Paper Awards and Recognition
Awards are presented annually for the Symposium Outstanding Paper (selected by Symposium attendees), the Best Paper (selected by the Technical Program Committee), and the Best Student Paper. The Best Paper is considered for presentation at the RCJ EOS/ESD Symposium in Japan. Either Best Paper or Symposium Outstanding Paper will also be selected for presentation at the SMTA International Conference. Eligible student contributions for the Best Paper Award should be marked as such by the authors at the time of abstract submission.

Deadlines
The submission deadline is Friday, January 14, 2011. Late submissions will not be accepted. Abstracts not meeting guidelines may not be accepted. The final submission deadline for the finished papers will be Friday, June 17, 2011. ESDA reserves the right to withdraw any paper not meeting the guidelines, including deadlines. Your paper MUST be submitted by the deadline. Final papers will be limited to a maximum of 10 pages - guidelines will be provided after acceptance of the paper.

Papers are solicited in the following areas:
I. Component Level EOS/ESD
• On-Chip Protection Devices & Techniques
• EOS/ESD Failure Analysis
• ESD Device and Circuit Simulation
• IC Design and Layout Issues
• Transmission Line Pulse and Other Testing Methods
• Modeling and Physics of EOS/ESD
• ESD & Latchup, or other Reliability Aspects
• Processing Issues and Effects • RF Devices and Circuits
• ESD in Advanced Technologies (Multi-gate, SOI, SiGe, Compound Semiconductors, Carbon Nano-tubes, etc.)
• New ESD Phenomena in MEMS (Microelectromechanical Systems)
• High Voltage, High Power Technologies (BiCMOS, HV CMOS)
II. System Level EOS/ESD
• Simulators, Calibration and Correlation
• Case Studies, Reviews and Analysis
• Optical Networks ESD
• Test Methods and Procedures
• ESD Detection and Measurement Techniques
• Modeling and Simulation
• ESD Electronic Design Automation (EDA)
Ill. EOS/ESD Factory Level and Materials Technology
• Packaging and Handling
• Case Studies, Reviews and Analysis
• Test Methods and Procedures
• Transient ESD/EMI Induced Upset
• Air Ionization and Uses
• Troubleshooting Techniques
• Facility Design
• Management Issues (cost/benefit analyses, etc.)
• ESD Control Materials
• ESD Shunting Packaging Technology
• Use of Antistatic Materials
• Chemistry
IV. Electrostatic Considerations
• Biomedical & Chemical Industry Electrostatic Control
• Graphic Arts Electrostatic Control
• ESD Control in Explosives and Pyrotechnics
• Oil/Petroleum Industry Electrostatic Control
• Aircraft, Spacecraft and Avionics ESD • Other ESD Topics
V. Magnetic Recording Heads and Ultra Sensitive Devices
• Testing and Analysis
• Protection Techniques
• Special Considerations for Extremely Sensitive Devices
• Failure Analysis Techniques and Interpretations
VI. ESD Standards – Components, System, Factory & Materials
• Test Methods and Procedures
• Round-Robin Testing, Results and Analysis
• Standards - Comparisons and Analysis
• Case Studies

Accepted papers covering selected topics may be considered for review for possible publication in a special issue of either the IEEE Transactions on Components, Packaging and Manufacturing Technology, the Journal of Electrostatics, the Micro-Electronics Reliability Journal, IEEE Transactions on Device and Materials Reliability (TDMR), or other appropriate publications.

For more information contact

Lisa Pimpinella
ESD Association
7900 Turin Road, Building 3
Rome, NY 13440
USA
Phone: (+1)315-339-6937
Fax: (+1)315-339-6793
e-mail: info@esda.org