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IOP--ICMM--Ei and Scopus 2020 : IOP--2020 11th International Conference on Mechatronics and Manufacturing (ICMM 2020)--Ei Compendex and Scopus | |||||||||||
Link: http://www.icmm.org/ | |||||||||||
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Call For Papers | |||||||||||
ICMM 2020 | Chuo University, Tokyo, Japan - Ei Compendex and SCOPUS★
★ Full name: 2020 11th International Conference on Mechatronics and Manufacturing (ICMM 2020) ★ Website: http://www.icmm.org/ ★ Time:January 10-12, 2020 ★ Place: Tama Campus, Chuo University, Tokyo, Japan Conference Venue: http://icmm.org/venue.html The 2020 11th International Conference on Mechatronics and Manufacturing (ICMM 2020) will be held at Tama Campus, Chuo University, Tokyo, Japan during January 10-12, 2020. This conference will provide a remarkable opportunity for the academic and industrial communities to address new challenges and share solutions, and discuss future research directions. Contributions are expected from academia, industry, and management agencies. ICMM 2020 provides a forum for scientific advances in the theory and practice of Mechatronics and Manufacturing. It is a highly selective, single-track meeting that will be soliciting submissions presenting significant, original, and previously unpublished research. ICMM 2020 aims to be one of the leading international conferences in the world, and it will provide an exciting environment for researchers to present and discuss the latest technologies and applications. ★Call for paper★ Topic about: (T1) Materials Science and Engineering Metallic Alloys, Tool Materials, Superplastic Materials, Ceramics and Glasses, Composites, Amorphous Materials, Nanomaterials, Biomaterials, Multifunctional Materials, Smart Materials, Engineering Polymers, Functional materials, Nuclear fuel materials, Biomaterals, sensors and surfaces, Thin Film Chalcogenide Photovoltaic Materials, Nuclear Materials, Magnetic Materials, Multi Functional Magnetic Materials, Superconducting Materials, Structured Materials, Spintronics Materials and Devices, Hard/Soft Magnetic Materials, Crosscutting materials (T2) Materials Properties, Measuring Methods and Applications Ductility, Crack Resistance, Fatigue, Creep-resistance, Fracture Mechanics, Mechanical Properties, Electrical Properties, and Magnetic Properties, Corrosion, Erosion, Wear Resistance, Non-Destructive Testing, Reliability Assessment, Toxicity, Working Properties of Materials and Products, Large Scale Applications, Electronics Applications (T3) Methodology of Research and Analysis and Modelling Electron Microscopy, X-ray Phase Analysis, Metallography, Quantitative Metallography, Image Analysis, Computer Assistance in the Engineering Tasks and Scientific Research, Numerical Techniques, Statistic Methods, Residual Life Analysis, Process Systems Design, Mould Flow Analysis, Rapid Prototyping, CAM, CAMS, CAQ, Engineering Design, Technological Design, Materials Design, Computational Material Science, Materials and Engineering Databases, Expert Systems, Artificial Intelligence Methods (T4) Materials Manufacturing and Processing Casting, Powder Metallurgy, Welding, Sintering, Heat Treatment, Thermo-Chemical Treatment, Thin & Thick Coatings, Surface Treatment, Machining, Plastic Forming, Quality Assessment, Automation Engineering Processes, Robotics, Mechatronics, Technological Devices and Equipment, Theoretical Fundamentals of Cleaner Production, Industrial Application of Cleaner Production Methods, Production and Operations Management, Production Planning and Control, Manufacturing Technology Management, Quality Management, Environmental Management, Safety and Health Management, Project Management, Physical Distribution and Logistics Management, Supply Chain Management, Productivity and Performance Management, Modeling, analysis and simulation of manufacturing processes, High-speed/precision machining, Virtual manufacturing and concurrent engineering, Green design and manufacturing, Digital and agile manufacturing, PDM, ERP, logistics and supply chain, Bionic mechanisms and bio-manufacturing, Tribology in Manufacturing Processes, Integrated Manufacturing System, Laser Processing Technology, Materials Machining, Micro- and nano-fabrication, materials processing and technology, Thermal Engineering Theory and Applications, Testing, measuring, monitoring and controlling of manufacturing processes, Engineering Optimization, Product Design and Development,Project/Engineering Management (T5) MEMS, NANO, and Smart Systems-on-Chip Nanoelectronics, Spintronic Devices and Systems, Smart Sensor Technology and Measurement Systems, Electroactive Polymer Actuators and Devices, Damping and Isolation , Micro-fluidic Systems, Nano-imaging, Scanning Probes, and Molecular Manipulation and Devices, Active Materials: Behaviour and Mechanics, Industrial and Commercial Applications of Smart Structure Technologies, Smart Electronics, MEMS, and BioMEMS, Smart Structures and Integrated Systems, Nano-optics and Nano-photonic Devices, Novel Fabrication Processes, Laser Micromachining and Nanomachining, Nano-composites, Bio-electronics, Bionanotechnology, and Molecular Nanotechnology (T6) Energy Systems Renewable and green energy systems, Biomass, wind and solar energy resources and technologies, Alternative energy technologies and sources, Fuel cells and hydrogen energy, Energy storage technologies, Advanced Energy Systems, Advanced power generation, transmission and automation, Distributed energy systems, Polygeneration systems, Energy efficiency and management, Energy process and system modeling and optimization, Combined heat and power technologies (T7) Mechatronics, Automation and Signal Processing Mechatronics, Intelligent echatronicsIndustrial Robotics and Automation, Intelligent control, neuro-control, fuzzy control Industrial, Automation and Process Control, Distributed Control System, Embedded System, Control system modeling and simulation techniques, Enterprise Informationization and information processing technology, Virtual Instrumentation, Sensors, multi-sensor data fusion algorithms, Advanced measurement and Machine Vision system, Transmission and control of Fluid, Dynamics, Vibration and Control, Robotics biomimetics, Automation, Opto-electronic elements and Materials, Laser technology and laser processing, Applications of micro and nano systems, Manufacturing Process Simulation, CIMS and Manufacturing System, Mechanical and Liquid Flow Dynamic, CAD/CAM/CIM, Vibration Measuring and Reliability Analysis, Finite Element Analysis and structure optimization, Fault Diagnosis and Maintenance Theory, Intelligent Mechatronics and Robotics, Elements, Structures, Mechanisms, and Applications of Micro and Nano Systems For details about topics, please visit at http://www.icmm.org/cfp.html ★ Publication Submitted paper will be peer reviewed by conference committees Accepted papers will be included into ICMM 2020 Conference Proceedings which will be published into IOP Conference Series: Materials Science and Engineering (doi:10.1088 / ISSN.1757-899X), which is submitted for indexing to by EI Compendex, Scopus, Thomson Reuters (WoS), Inspec,et al. ICMM 2019 and ICMM 2018 Proceedings were all online via IOP Conference Series: Materials Science and Engineering. ★Submission★ 1. Full paper(publication and presentation) 2. Abstract (presentation) For full paper, please upload it to the Electronic Submission System (.pdf) http://confsys.iconf.org/submission/icmm2020 For abstract, please send it to icmm@asr.org More detail about submission, please visit at http://www.icmm.org/author.html ★★Conference Schedule★★ January 10, 2020 | 10:00 – 16:30 | Registration,collecting conference materials January 11, 2020 | 09:00 – 20:30 | Opening Remark & Keynote Speeches & Presentation Sessions January 12, 2020 | 10:00 – 16:00 | One Day Tour (Optional to register) ★Conference Venue★ Tama Campus, Chuo University, Tokyo, Japan Add.: 742-1 Higashinakano Hachioji-shi, Tokyo 192-0393 Japan More information, please visit: http://icmm.org/venue.html ★★Contact: Ms. Jerain Wang (Conference Secretary) E-mail: icmm@asr.org Tel: +861-325-333332-3 The Tel. number is available to call only within workday. 9 am till 6 pm. |
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