The 2021 IEEE XXVIII International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity.

2020 INTERCON will be a VIRTUAL CONFERENCE.

Topics of interest include, but are not limited to:
• Communication systems
• Semiconductors and devices
• Computers and information technology
• Signal processing
• Systems and control
• Emerging technologies
• Circuits and systems
• Power generation, transmission and distribution
• Renewable energy sources, Smartgrid technologies
• Optoelectronic materials, devices and systems
• Power electronics, systems and applications
• Electrical machines and adjustable speed drives
• High voltage engineering and insulation technology
• Algorithms and complexity
• Architecture and organization
• Graphics and visualization
• Information management, assurance and security
• Intelligent systems
• Parallel and distributed Computing
• Software engineering
• Social issues and professional practice

SUBMISSION:
The official language of 2021 IEEE INTERCON is ENGLISH. The maximum number of authors per paper, including co-authors is four (4). Papers must be submmited in PDF and no longer than four (4) pages, following the IEEE Conference Template available at:
https://www.ieee.org/conferences/publishing/templates.html
We will use EasyChair system for submissions here: https://easychair.org/conferences/?conf=2021ieeeintercon

Important dates
• Full paper submission deadline: May 15, 2021
• Notification of acceptance: June 30, 2021
• Final paper submission deadline: July 10, 2021
• Autor registration: July 15, 2021
• Oral presentations: August 5 to 7, 2021