Full Name: 2027 10th International Conference on Smart Materials Applications (ICSMA 2027)
Abbreviation: ICSMA 2027
Sapporo, Japan | January 8-10, 2027
http://www.icsma.org


Smart Materials in Winter Wonderland.
The 10th International Conference on Smart Materials Applications (ICSMA 2027) will be held from January 8 to 10, 2027 in Sapporo, the capital of Hokkaido, known as Japan's "Snow Country". Here, you can enjoy a unique winter experience of snowscapes, hot springs, canals, and gourmet food.
ICSMA 2027 is co-organized by the South Asia Institute of Science and Engineering (SAISE), Tokyo University of Science (Japan), Yonsei University (South Korea), and Sichuan University (China), focusing on new advances and applications in the field of smart materials and providing a broad platform for experts and scholars in related fields to exchange the latest research results and discuss academic development directions.

**Committees
Conference Committee Chairs
Prof. Kazuo Umemura, Tokyo University of Science, Japan
Prof. Jong Hak Kim, Yonsei University, South Korea
Prof. Xiaohong Zhu, Sichuan University, China

Program Committee Chairs
Assoc. Prof. Jung Tae Park, Yonsei University, South Korea
Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore
Dr. Seok-Keun Koh, C&G Hitech Co., Ltd, Korea

**Conference Proceedings
All submissions will be peer reviewed, the registered and presented papers will be published in the journals of Scientific.Net(https://www.scientific.net/) collection. Indexed by Elsevier: SCOPUS.

**History of ICSMA
ICSMA 2026 | JANUARY 28-30, 2026 | TOKYO UNIVERSITY OF SCIENCE, JAPAN.
ICSMA 2025 | JANUARY 08-10, 2025 | YONSEI UNIVERSITY, SOUTH KOREA
ICSMA 2024 | JANUARY 14-16, 2024 | SINGAPORE
ICSMA 2023 | JANUARY 06-08, 2023 | TOKYO, JAPAN
ICSMA 2022 | JANUARY 21-24, 2022 | VIRTUAL CONFERENCE
ICSMA 2021 | JANUARY 21-24, 2021 | VIRTUAL CONFERENCE
ICSMA 2020 | JANUARY 13-16, 2020 | YONSEI UNIVERSITY, SOUTH KOREA
ICSMA 2019 | JANUARY 19-22, 2019 | TOKYO, JAPAN
ICSMA 2018 | JANUARY 26-28, 2018 | SINGAPORE

**Call for Papers
(01) Smart & Functional Materials
(02) Material Properties & Characterization
(03) Manufacturing & Processing
(04) Computational & AI-Driven Approaches
(05) Applications & Sustainability
For more topics, please visit: https://www.icsma.org/cfp.html

**Submission
Please upload your abstract/full paper to iconf. Submission System (http://confsys.iconf.org/submission/icsma2027). Any questions, please feel free to contact via icsma@saise.org.
1. Full Paper (Presentation and Publication)
Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceeding.
2. Abstract (Presentation only)
Accepted abstract will be invited to give the presentation at the conference, the presentation will not be published.
★ For more details, please visit: https://www.icsma.org/submission.html

**Conference Schedule
2027.01.08: Sign-in & Conference Kit Collection
2027.01.09: Opening Ceremony, Keynote Speeches, Parallel Sessions, Dinner Banquet
2027.01.10: Parallel Sessions, Tour/Visit (Optional)

**Contact Us
Ms. Sia Fan
Email: icsma@saise.org
Tel: +852-36789835 (Hong Kong) / +86-15008402564 (China)