TEI: Tangible and Embedded Interaction

FacebookTwitterLinkedInGoogle

 

Past:   Proceedings on DBLP

Future:  Post a CFP for 2022 or later   |   Invite the Organizers Email

 
 

All CFPs on WikiCFP

Event When Where Deadline
TEI 2021 15th International ACM Conference on Tangible, Embedded, and Embodied Interaction
Feb 14, 2021 - Feb 17, 2021 Salzburg, Austria Aug 7, 2020 (Jul 24, 2020)
TEI 2020 Tangible and Embedded Interaction
Feb 9, 2020 - Feb 12, 2020 Sydney, Australia Aug 10, 2019
TEI 2017 11th International Conference on Tangible, Embedded and Embodied Interactions
Mar 20, 2017 - Mar 23, 2017 Yokohama, Japan Aug 2, 2016
TEI 2016 Conference on Tangible Embedded and Embodied Interaction
Feb 14, 2016 - Feb 17, 2016 Eindhoven Aug 2, 2015
TEI 2015 9th International Conference on Tangible, Embedded and Embodied Interaction
Jan 15, 2015 - Jan 19, 2015 Stanford, USA Aug 1, 2014
TEI 2014 Eighth International Conference on Tangible, Embedded and Embodied Interaction
Feb 16, 2014 - Feb 19, 2014 Munich, Germany Aug 1, 2013
TEI 2013 Seventh International Conference on Tangible, Embedded and Embodied Interaction
Feb 10, 2013 - Feb 13, 2013 Barcelona, Spain Aug 6, 2012
TEI 2012 TANGIBLE, EMBEDDED AND EMBODIED INTERACTION
Feb 19, 2012 - Feb 22, 2012 Kingston, ON Canada Sep 1, 2011
TEI 2011 Fifth International Conference on Tangible and Embedded Interaction - Explorations
Jan 22, 2011 - Jan 26, 2011 Funchal, Portugal Oct 17, 2010
TEI 2008 Tangible and Embedded Interaction
Feb 18, 2008 - Feb 21, 2008 Bonn, Germany Oct 5, 2007
 
 

Present CFP : 2021

TEI2021 is the 15th annual conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. The ACM-TEI conference has gained substantial visibility and activity over the past decade. It brings together researchers, practitioners, businesses, artists, designers and students from various disciplines, including engineering, interaction design, computer science, product design, media studies and the arts.

This year TEI comes to Austria, which has a long tradition of digital art. Our theme for 2021 is The Art of Interaction. The theme invites participants to speculate on a vision of how art impacts, inspires and shapes interaction. We consider art in the broadest sense: from physical to virtual works as well as across all genres, such as interactive installations, performance, visual art, and (tangible) sculptures.

Topics and application areas are diverse, including: tangible user interfaces, physical interaction design, flexible and shape changing displays, haptic interaction, smart objects and cities, interactive surfaces, augmented and mixed reality, ubiquitous computing, interactive art and performance, social and wearable robotics, hybrid games, embodied cognition and perception, fashion and material design, furniture and architectural design, learning and education, music and sound interfaces, human-augmentation, as well as productivity and creativity tools in domains ranging from scientific exploration to artistic practice. We invite submissions from a wide variety of perspectives: theoretical, philosophical, conceptual, technical, applied, and/or artistic.

The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, demonstrations, posters, art installations and performances, and participation in hands-on studios and theoretical workshops.

CONTRIBUTION TYPES
Authors are invited to submit high-quality papers that contribute to advancing this rapidly developing field. The length of a submission should be commensurate with its contribution. The shortest version of your paper is probably the best. Previous TEI papers had between 4-10 pages in the ACM two-column format, not including references.

We highlight the following non-exclusive set of contribution types:

Artefact: We welcome submission of research artefacts that advance the state of the art in Tangible, Embedded and Embodied Interaction. Artefacts can demonstrate new technologies (e.g., new sensing techniques or algorithms), new forms of input (e.g., novel interaction techniques) or new designs (e.g., provocative or evocative objects, systems or services).

Method: Tools, approaches and techniques that enable researchers, technologists, designers and practitioners to study, research and work on Tangible, Embedded and Embodied Interaction. Methods can include new forms of study design or data analysis, new engineering processes or frameworks that can structure and constrain generative design activity.

Theory: Explorations, extensions, refutions, instantiations and other developments of and to the theories pertaining to Tangible, Embedded and Embodied Interaction, such as theories of cognition or the mind and designerly theories and conceptual frameworks.

Empirical: Studies and data that add to our understanding of Tangible, Embedded and Embodied Interaction by, for example, providing quantitative accounts of salient aspects of human performance or qualitative characterizations of experiences with tangible artefacts and systems. Empirical submissions can detail outcomes from a very wide range of lab, field and online studies.

Respecting the diversity of approaches and methods that together make up TEI, each contribution type will be peer-reviewed on its own merits. We seek high-quality work regardless of the specific subdomain or topic and we expect the work to be positioned firmly in, and building on, prior research in our field, in particular wherever relevant referencing work that was presented at earlier TEI conferences.

Accepted submissions of all contribution types will be included as papers in the conference proceedings, which will be available in the ACM Digital Library.

Further information about submission procedures, templates, the reviewing process and types of presentations will be released on the conference website: tei.acm.org

We hope to see you in Salzburg!

Program committee chairs:
Ian Oakley (Ulsan National Institute of Science and Technology, South Korea)
Katrin Wolf (Beuth University of Applied Sciences, Germany)

RELATED DATES
December 15, 2020 ACM-W Scholarships for Attendance at Research Conferences

 

Related Resources

Scopus-D2ME 2020   5th International Conference on Design, Mechanical and Material Engineering (D2ME 2020)
IUI 2021   ACM Intelligent User Interfaces 2021
Scopus-ICMEAS 2020   6th International Conference on Mechanical Engineering and Automation Science (ICMEAS 2020)
ACM--ICHMI--Ei Compendex, Scopus 2021   ACM--2021 International Conference on Human–Machine Interaction (ICHMI 2021)--EI Compendex, Scopus
EAI DLI 2020   (Virtual) 5th EAI International Conference on Design, Learning & Innovation
ICHMI--ACM, Ei, Scopus 2021   ACM--2021 International Conference on Human–Machine Interaction (ICHMI 2021)--EI Compendex, Scopus
VLSICS 2020   International Journal of VLSI design & Communication Systems
TEI 2020   Tangible and Embedded Interaction
ETIS 2020   Fourth European Tangible Interaction Studio
Scopus-MSME 2020   3rd International Conference on Materials Science and Manufacturing Engineering (MSME 2020)