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Present CFP : 2024 | ||||||||||||||||||||||||||||||||||||||||||||||
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Full name: 2024 IEEE 14th International Symposium on Industrial Embedded Systems
Abbreviation: Chengdu, China, October 23-25, 2024 Official Website: https://ieee-sies.org/ 2024 IEEE 14th International Symposium on Industrial Embedded Systems (SIES 2024) will be held from 23 to 25 October in Chengdu, China. SIES 2024 is co-sponsored by IEEE and University of Electronic Science and Technology of China, China, technically sponsored by IEEE Future Networks, EMSIG, Virginia Tech, etc. The aim of the symposium is to bring together researchers and practitioners from industry and academia. SIES provides a platform to report on recent developments, deployments, technology trends and research results, as well as to discuss and start initiatives related to embedded systems and their applications in a variety of industrial environments. * SIES 2024 accepted full papers will be included in IEEE Conference Proceedings, slected excellent proceedings papers will be recommended to SCI journals. * Conference History The SIES series were hosted by: - University of Nice Sophia Antipolis, France (2006) - Uninova, Portugal (2007) - LIRMM/CNRS, France (2008) - Ecole Polytechnique F d rale de Lausanne, Switzerland (2009) - University of Trento, Italy (2010) - Malardalen University, Sweden (2011) - Karlsruhe Institute of Technology, Germany (2012) - Polytechnic Institute of Porto, Portugal (2013) - Scuola Superiore S. Anna, Italy (2014) - Siegen University, Germany (2015) - AGH UST, Poland (2016) - France (2017) - Graz University of Technology, Austria (2018) *Conference Proceedings All the accepted regular full papers will be included in IEEE Conference Proceedings and submitted for Ei Compendex & Scopus index. *Submission By EasyChair: https://easychair.org/my/conference?conf=sies2024 * Call for papers Topics of interest include, but are not limited to: - EMBEDDED SYSTEMS - SYSTEM-ON-CHIP AND NETWORK-ON-CHIP DESIGN & TESTING - NETWORKED EMBEDDED SYSTEMS AND EDGE COMPUTING - EMBEDDED APPLICATIONS * SIES Awards - OUTSTANDING PAPER AWARD - BEST REVIEWER AWARD - BEST PAPER AWARD - BEST WIP PAPER AWARD - BEST PRESENTATION AWARD * Venue: Xiangyu Hotel (pending) Address: No.10, North Renmin Road, Chengdu, China * Contact: Conference Secretary Ms. Amy J.Y.Hu Email: ieee-sies@academic.net More information, please refer to: https://ieee-sies.org/ | ||||||||||||||||||||||||||||||||||||||||||||||
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